Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof
US11148317B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB27K2240/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing wood material boards with reduced emission of volatile organic compounds (VOCs), including: a) producing woodchips from suitable timbers; b) heat-treating at least one portion of the woodchips at a temperature between 150° C. and 300° C. for a period of 1 to 5 hours; c) crushing the wood chips that are not heat-treated and at least one portion of the heat-treated woodchips by machining in order to obtain wood shavings or by solubilizing in order to obtain wood fibers; d) gluing the wood shavings or wood fibers with at least one binding agent; e) applying the glued wood shavings onto a transport belt while forming a multi-layered shavings cake or applying the glued wood fibers onto a transport belt while forming a single-layer fiber cake; and f) compressing the shavings cake or the fiber cake to form a wood material board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.