Additive manufacturing, bond modifying system and method
US11148319B2 · kind B2 · utility
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62References
20Claims
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Key dates
| Filing date | Jan 30, 2017 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jan 25, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control a state of matter of each successive additive layer. Accordingly, the system may be used to alter the chemical bond arrangement of the material forming the various additive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.