Method for plasma treating substrates and for bonding plasma treated substrates
US11148408B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | May 20, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2400/228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for plasma treating a surface of a first substrate is disclosed. The method may comprise generating a plasma flume using a plasma treatment device having a nozzle. The plasma flume may emanate through a flume aperture of the nozzle at an emanation angle of about 5 degrees or less. The emanation angle may be defined as an angle between a central axis of the nozzle and a central axis of the flume aperture. The method may further comprise plasma treating the surface of the first substrate with the plasma flume by scanning the plasma flume over the surface of the first substrate. The first substrate may be one of a consolidated thermoplastic material and a cured thermoset material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.