Processes for refurbishing a spent sputtering target
US11149343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2016 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Processes for refurbishing a spent sputtering target with a non-circular shape are disclosed. In one form, the processes include the steps of receiving one or more spent sputtering targets, inspecting and weighing the spent sputtering targets, removing any contaminants or other surface impurities from the spent sputtering target surfaces, preparing a hot press die with spacers, disposing the spent sputtering targets in the hot press die, the spacers used to center the spent sputtering targets therein, loading fresh metal refilling powder into the die to account for depleted regions of the spent sputtering targets to produce a powder-filled sputtering target, and applying sufficient heat and force to the filled sputtering target to produce a refurbished sputtering target with homogeneous composition and sufficient adhesion strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.