Thermal energy absorbing structures
US11150065B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2016 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF42B39/18
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thermally-sensitive hardware is at least partially enclosed within a container in which reactants for a solid-solid endothermic chemical reaction are disposed, surrounding at least a portion of the thermally-sensitive hardware. The reactants or a structure including the reactants are positioned between the thermally-sensitive hardware and a heat source, such as an external surface of a missile traveling through atmospheric gases at extremely high speed and experiencing extreme frictional heating. The reactants absorb heat during the solid-solid endothermic reaction to thermally protect the thermally-sensitive hardware. The reactants are preferably selected to absorb heat of at least 5 kilo-Joules per gram (kJ/g) during the solid-solid endothermic chemical reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.