Heterodyne laser interferometer based on integrated secondary beam splitting component
US11150077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2020 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Aug 26, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2290/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a heterodyne laser interferometer based on an integrated secondary beam splitting component, which belongs to the technical field of laser application; the disclosure inputs two beams that are spatially separated and have different frequencies to the heterodyne laser interferometer based on the integrated secondary beam splitting component, wherein the integrated secondary beam splitting component includes two beam splitting surfaces that are spatially perpendicular to each other; and the two beam splitting surfaces are plated with a polarizing beam splitting film or a non-polarizing beam splitting film, and a measurement beam and a reference beam are the same in travel path length in the integrated secondary beam splitting component. The heterodyne laser interferometer of the disclosure significantly reduces periodic nonlinear errors, has the advantages of simple structure, good thermal stability, large tolerance angle and easy integration and assembly compared with other existing heterodyne laser interferometers with spatially separated optical paths, and meets the high-precision and high-resolution requirements of high-end equipment on heterodyne laser interferometr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.