Radio frequency filter fin pack design in consumer electronics
US11150700B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0007
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.