Multilayer ceramic electronic component with internal electrode including nickel powder and copper coating layer and method of manufacturing the same
US11152153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Nov 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.