Lift-off embedded micro and nanostructures
US11152227B2 · kind B2 · utility
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Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.