Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material
US11152281B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Nov 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a cooling circuit on at least one integrated circuit chip includes producing a cooling circuit on a first face of the chip. Producing the cooling circuit includes forming a definition pattern of the cooling circuit on the first face of the chip, the pattern having at least one layer of a sacrificial material; coating the pattern with at least one resin layer; and at least partially removing the sacrificial material from the pattern so as to open the cooling circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.