Thermoelectric module with integrated printed circuit board
US11152557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.