Electronic component manufacturing method
US11152570B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Sep 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/8828
Abstract
The disclosure concerns an electronic component manufacturing method including a first step of etching at least one first layer followed, with no exposure to oxygen, by a second step of passivating the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.