Method and device for encapsulating components
US11152590B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jun 14, 2017 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jun 14, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C27/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.