Patent · US Active

Method and device for encapsulating components

US11152590B2 · kind B2 · utility

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12Claims
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Key dates

Filing dateJun 14, 2017
Grant dateOct 19, 2021
Priority date
Expiry dateJun 14, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03C27/06
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.