Technologies for densely packaging network components for large scale indirect topologies
US11153105B2 · kind B2 · utility
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11References
19Claims
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Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Oct 6, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/50
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.