Modular hybrid circuit packaging
US11153985B2 · kind B2 · utility
1Cited by
31References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.