Thermal fluid ejection heating element
US11155085B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 17, 2017 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/021
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal fluid ejection heating element may include a first conductive trace, and an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace. The perforations within the perforated resistive thin film material defines a resistance of the thermal fluid ejection heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.