Pick including polycrystalline diamond compact
US11156087B2 · kind B2 · utility
0Cited by
87References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2019 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Apr 24, 2039 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21C35/1837
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Embodiments disclosed herein are directed to a system for removing road material. In an embodiment, the system may include a milling drum and at least one pick mounted on the milling drum. The pick may include polycrystalline diamond at least partially forming one or more working surfaces of the pick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.