Systems and methods for bonding of dissimilar substrates
US11156104B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2300/603
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate may be coupled to a second substrate by a composite joint between the first substrate and the second substrate. The composite joint may be comprised of a first adhesive material and a second adhesive material. The first adhesive material may be disposed on the first substrate, and the second adhesive material may be disposed to the first adhesive material. The composite joint between the first substrate and the second substrate may provide an isolation layer therebetween, preventing galvanic corrosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.