Vibration sensor package
US11156531B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2018 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Oct 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M13/028
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor package for sensing vibration is described. The sensor package includes a carrier and a piezoelectric module coupled to the carrier. A wireless vibration sensor is further coupled to the carrier at a distance from the piezoelectric module. The sensor package further includes one or more conductive paths coupling the piezoelectric module to the wireless vibration sensor. The sensor package may be disposed on a bearing housing of a rail vehicle. The sensor package may also be utilized in marine, land and aviation applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.