Bonded optical systems and applications thereof
US11156764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2016 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Aug 7, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.