Wafer-level handle replacement processing
US11156773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2020 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Sep 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/15
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.