Fiber-less photonic system in an integrated package
US11156790B2 · kind B2 · utility
0Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 2019 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides a photonic package system comprising at least two optical alignment pins integrated on a package substrate. A key feature of this invention is the addition of alignment structures within the package. When combined with the use of micro optics it enables a ‘fiber-less’ photonic package system that requires no physical connection between and optical fiber and the photonic package system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.