Socket interconnector for high pad count memory cards
US11157197B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Jul 13, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include an anisotropic elastomeric sheet provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.