Ceramic electronic component with lead terminals having a coating layer
US11158460B2 · kind B2 · utility
1Cited by
27References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Aug 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/236
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.