Patent · US Active

Modular WLCSP die daisy chain design for multiple die sizes

US11158551B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

Dialog Semiconductor (UK) Limited · GB

Inventors

Duncan Barclay · Swindon, GB
Jesus Mennen Belonio, Jr. · Germering, DE
Edward Horsburgh · Devizes, GB

Key dates

Filing date	Jan 7, 2020
Grant date	Oct 26, 2021
Priority date	—
Expiry date	Jan 7, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01013
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method to fabricate a modular die daisy chain design for wafer level chip scale package (WLCSP) board level reliability testing is described. A wafer is provided having pairs of solder balls electrically connected to each other by underlying metal pads. The wafer is singulated into dies of any of a plurality of sizes as required for testing. Thereafter one of the singulated dies is mounted to a test printed circuit board (PCB). The pairs of solder balls are electrically connected in a daisy chain on the test PCB.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.