Chip antenna module
US11158928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2020 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | May 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.