Connectors for integrated circuit packages
US11158969B2 · kind B2 · utility
0Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2018 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Feb 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.