Heat sink for power supply panel
US11158998B1 · kind B1 · utility
4Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02B1/32
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat sink is described for cooling an electrical component. The heat sink has heat dissipating structures connected to a base. The base is attached to a connector which makes contact with a heat transfer contact of the electrical component. The electrical component may be a power supply bus which supplies electrical current to a series of circuit breakers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.