Micro-strand heat dissipation system
US11160196B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Oct 26, 2021 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-strand heat dissipation system includes a first processing device and a plurality of first micro-strand heat dissipator elements that are each positioned on the first processing device in a spaced apart orientation from the other first micro-strand heat dissipator elements. Each of the plurality of first micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that extends into the first processing device from an outer surface of the first processing device, and a second micro-strand heat dissipator element portion that extends from the outer surface of the first processing device. The first processing device may define a plurality of micro-strand heat dissipator connector features to which each of the plurality of first micro-strand heat dissipator elements may be connected, or the plurality of first micro-strand heat dissipator elements may be integrated as part of the first processing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.