Molding fastener products
US11161283B2 · kind B2 · utility
2Cited by
12References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Feb 13, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/729
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of molding resin on a flexible substrate includes forming discrete regions of resin and forcing resin of at least some of the regions into molding cavities to form a respective array of resin projections extending from a resin base of the regions. Forming the discrete regions of resin includes depositing molten resin directly onto either the substrate or a surface in which the cavities are defined. The resin is deposited as the substrate moves in a processing direction, and the resin is deposited by resin sources spaced from each other along the processing direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.