Method for manufacturing substrate and liquid ejection head substrate
US11161344B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 24, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1111
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.