Heated floor mat assembly
US11161444B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jan 30, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2471/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A floor mat assembly for use on a floor comprises a floor mat, a first adhesive layer, a heating element, a second adhesive layer, and an insulative foam support layer. The floor mat comprises a topside for interaction with a person. The heating element is bonded to an underside of the floor mat with the first adhesive layer to heat the floor mat. The foam support layer is bonded to an underside of the heating element with the second adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.