Decoupling structure for accelerometer
US11161733B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Aug 27, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0882
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.