Composition for conducting material removal operations and method for forming same
US11161751B2 · kind B2 · utility
0Cited by
11References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jun 3, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition can comprise a carrier including a liquid and an abrasive particulate contained in the carrier, the abrasive particulate having, on average, at least 10 wt % cerium oxide in the abrasive particulate and a cerium 3+ ratio (Ce 3+/total cerium) of at least 0.1. In another embodiment, a slurry composition can comprise a liquid carrier comprising water, cerium oxide particles, and free silicate ions, wherein a material removal rate when polishing a silicon oxide wafer can be is increased by at least 3% in comparison to a slurry composition not including free silicate ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.