Plate package, plate and heat exchanger device
US11162736B2 · kind B2 · utility
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15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2250/102
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plate package for a heat exchanger device includes a plurality of heat exchanger plates with mating abutment portions forming a fluid distribution element in every second plate interspace thereby forming in the respective second plate interspaces two arc-shaped flow paths wherein a respective one of the two flow paths is divided into at least three flow path sectors arranged one after the other along a respective flow path. A plate and a heat exchanger are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.