Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical system scanning mirror system
US11163151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jan 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N2/028
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A piezoelectric MEMS scanning mirror system is provided. In particular, the efficiency and life of the system are improved by use of new bonding methods. Mechanical and electrical connections between the actuator frame of a piezoelectric MEMS scanning mirror system and the piezoelectric actuators in the system may be created using an anisotropic conductive adhesive. An anisotropic conductive adhesive only conducts electricity across the bond line between a lower portion of the piezoelectric actuator and a top of the metal frame. One way this is done is to provide a sparse loading of conductive particles. When the piezoelectric element is compressed against the frame, the conductive particles only form a conductive path across the bond line. Grit blasting, sanding, or chemical etching may be used to roughen the metal surface prior to bonding. A surface roughness between 2 RMS and 6 RMS may be created on the metal frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.