Ultraviolet irradiation apparatus and method of manufacturing a semiconductor package using the same
US11164762B2 · kind B2 · utility
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7References
19Claims
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Key dates
| Filing date | Apr 3, 2020 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Apr 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultraviolet (UV) irradiation apparatus includes: a base module configured to support a wafer including a plurality of semiconductor chips, wherein the plurality of semiconductor chips are connected with each other via a die attach film (DAF); a vacuum module configured to provide the wafer with a vacuum and to remove air from the DAF; a UV irradiation module configured to irradiate UV to the wafer in the vacuum module; and an expanding module configured to expand the wafer in the vacuum module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.