Heat structure for thermal mitigation
US11165131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2020 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | May 30, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.