Adjustable conveyance curing system
US11166350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Sep 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Adjustable system and methods are provided that are used in curing a foam item. Induction heating assemblies, cooling mechanisms and a dynamic conveyance mechanism may be used in combination to heat and cool a mold containing the foam item as it is conveyed. The dynamic conveyance mechanism may have removable rollers that allow for chambers, such as the induction heating assemblies, to be placed into areas where removable rollers have been removed. As such, chambers may be placed into, taken out of, and moved around the dynamic conveyance mechanism. The flexibility of a dynamic conveyance mechanism allows for a curing process to be automated, adjusted, and customized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.