Fabrication process for flip chip bump bonds using nano-LEDs and conductive resin
US11166384B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 20, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Apr 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.