Interposer substrate, circuit module, and interposer substrate manufacturing method
US11166386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Dec 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.