Substrate assembly and method of bonding substrates
US11167284B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jun 13, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.