Self cutting wire bender
US11167337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | May 1, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21F11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for bending wire that includes a pin extending from an upper surface of a plate, a shaft extending through a center aperture of the plate and terminating in a bend head, a sleeve rotatably disposed around the shaft, a first motor for rotating the plate about the shaft, and a second motor configured to move the plate between extended, retracted and intermediate positions along the shaft. The plate positioned in the extended position and rotating causes the first pin to travel in front of a wire aperture of the bend head. The plate positioned in the intermediate and the retracted positions and rotating causes the first pin to travel underneath the wire aperture. The plate positioned in the retracted position causes the plate to engage with the sleeve such that rotation of the plate causes rotation of the sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.