Method of manufacturing liquid ejection head
US11167553B2 · kind B2 · utility
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11Claims
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Assignee
Inventor
Key dates
| Filing date | May 28, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jan 14, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/22
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The method of manufacturing a liquid ejection head according to the invention includes a bonding step, that is, a step of placing a plurality of element substrates on an adhesive layer formed on a bonding surface and heating the adhesive layer to bond the element substrates to a base material. The bonding step is started from one or two of a plurality of bonding regions located at the center portion of the base material in an arrangement direction of the element substrates and then performed toward the bonding regions located at both end portions of the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.