Patent · US Active

Moisture curable compositions

US11168213B2 · kind B2 · utility

2Cited by

2References

15Claims

0Family size

Assignee

Dow Silicones Corporation · US

Inventors

Yanxia Huang · 流花街道, CN
Yi GUO · Shanghai, CN
Xu Chen · Wenhe, CN

Key dates

Filing date	Jul 30, 2018
Grant date	Nov 9, 2021
Priority date	—
Expiry date	Sep 27, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31663
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Disclosed is a two-component silicone composition, which can cure via moisture. The composition generally has improved cure speed while maintaining good storage stability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.