Resin material and laminate
US11168216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2018 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jan 29, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.