Bonded hardware rapid cure system
US11168728B1 · kind B1 · utility
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20Claims
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Assignee
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Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Dec 24, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B47/003
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Embodiments of systems and methods for adhering hardware to a substrate, wherein the method comprises coupling the hardware with a rigid tube or an elastomeric tube, applying adhesive onto a bonding surface of the hardware, inserting the rigid tube or the elastomeric tube through an aperture of the substrate until a surface of the substrate contacts the bonding surface having adhesive applied thereon, and adhering the hardware to the substrate by applying localized heat through a heating component disposed within the rigid tube or the elastomeric tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.