Capillary device for use in heat pipe and method of manufacturing such capillary device
US11168944B2 · kind B2 · utility
0Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Aug 6, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49396
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.