Substrate embedded time of flight sensor packaging
US11169266B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jan 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/933
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method begins with forming a first wiring layer on a substrate, forming a cavity in the substrate, and laminating a bottom side of the substrate so as to cover a bottom side of the cavity. Next, an integrated circuit is placed within the cavity of the substrate, and then a first optically transparent layer is disposed on the top surface of the substrate to cover a top surface of the integrated circuit. The first optically transparent layer has an aperture formed therein exposing at least a portion of the top surface of the integrated circuit. A second wiring layer is disposed on a top surface of the first optically transparent layer in a pattern that does not obstruct light traveling to or from the top surface of the integrated circuit. The integrated circuit is a laser emitting integrated circuit or a reflected light detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.