Switching semiconductor device and cooling apparatus thereof
US11171073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Dec 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a switching semiconductor device and a cooling apparatus thereof. The cooling apparatus of the switching semiconductor device of the present disclosure comprises a first heat dissipation plate configured to facilitate heat dissipation of a surface of the semiconductor device at an installation space, and a second heat dissipation plate disposed inside the installation space along a thickness direction of the first heat dissipation plate. The installation space is formed in a predetermined size at the surface of the semiconductor device, and the second heat dissipation plate is configured to contact the first heat dissipation plate so as to allow heat exchange. Accordingly, a heat dissipation area may be increased without increasing a size of the installation space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.